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Industry:Semiconductors

Site:jiaco-instruments.com

Description:Visit JIACO at the upcoming IEEE Electronic Components and Technology Conference (ECTC), 2015 May 26-29th in San Diego.
JIACO Instruments provides world leading IC package decapsulation equipment based on revolutionary Microwave Induced Plasma (MIP) technology. The patented MIP decapsulation system facilitates superior true root cause analysis through the preservation of Cu, PdCu, Au & Al bond wires, minute original failure sites and original contaminants on bond pads and die. JIACO’s...

Specialties:plasma decapsulation systems, advanced IC package decapsulation, copper wire package decapsulation, thermally stressed package decapsulation, LED package decapsulation, 3D stacked die package decapsulation

Founded:2014

Company size:1-10 employees

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